Innodisk, the service driven flash and DRAM provider, is introducing DDR4 memory modules designed for industrial applications on Intel's upcoming Skylake platform. The new unbuffered long DIMM and compact SO-DIMM memory offerings will feature significantly lower power consumption and higher performance than comparable DDR3 modules and will have ECC error correction available for industrial and embedded applications. An extra thick 30u gold connector, on-board thermal sensors and conformal coatings make these JEDEC-compliant DDR4 modules especially suited for the next generation of industrial systems.
Better Embedded Performance
Operating at 2133Mhz, Innodisks’s DDR4 memory offers up to 30% better performance with 20% lower power consumption compared to current mainstream DDR3 SDRAM. With Intel Skylake projected to be the embedded platform of choice by the middle of 2015, Innodisk’s DDR4 memory modules will enable the next generation of embedded performance.
Especially suited for fanless computers, on-board thermal sensors alert the system to temperature changes. This allows the monitoring of individual memory module temperatures to throttle performance and prevent overheating.
30u Golden Finger
Innodisk’s proprietary 30u Golden Finger connector interface is 10 times thicker than the JEDEC standard of 3u and ensures a reliable memory interface in industrial usage.
Innodisk’s DDR4 memory has conformal coatings available to enhance reliability and service life in harsh industrial environments. Partnering with industry leader HumiSeal, Innodisk’s in-house production facility allows high quality application of protective coatings without risk of contamination or damage.
• Standard profile height of 30.0mm for SODIMM, and 31.25mm for UDIMM
• ECC for data integrity
• Single voltage
• Significantly improved airflow
• On-Die Termination using ODT pin
• Lead-Free and compliant with RoHS
• Average refresh period of 7.8us at 85°C or lower, and 3.9us between 85°C and 95°C